BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR

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BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR

Hlavní využití
Virtualization, HPCCDN, Edge Nodes, Cloud Computing,
Data Center Optimized, Storage Headnode

Podrobnosti
https://www.supermicro.com/en/products/system/up/1u/sys-111c-nr

Specifikace

Bundle obsahuje
SYS-111C-NR UP 1U X13SEDW-F, CSE-LB16TS-R860AW3
EWCSC 0% 3 YRS LABOR, 3 YRS PARTS, 1 YR CRS
UNDER LIMITED WRNTY
P4X-EMR4509Y-SRN61-LCC 4509Y 2P 8C/2.6G/125W (8/1.9, 4/2.7/105)
22.5M SGX64 DSA 7yr
SP5
2xx MEM-DR516MB-ER48 16GB DDR5-4800 1RX8 (16Gb) RDIMM
2x HDS-M2N4-480G0-E1-TXD-NON-080 SSD M.2 NVMe PCIe4 480GB 1DWPD TLC D,
80mm
SKT-1424L-001B-FXC SOCKET E E1B CARRIER LGA 4677 W/SHIM SP
MCC,LCC,DG1.0 ,RoHS
CBL-MCIO-1225M5Y MCIO (x8 to 2 x4) STR,25CM,85OHM,RoHS
CBL-MCIO-1240AM5-X MCIO (x8 to x8) STR,40CM,LNRV,85OHM,RoHS
MC0037 ASSEMBLY FEE
Specifikace serveru
Form Factor 1U Rackmount
Enclosure: 437 x 43 x 597mm (17.2" x 1.7" x 23.5")
Package: 605 x 197 x 822mm (23.8" x 7.8" x 32.4")
Processor Single Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Up to 64C/128T; Up to 320MB Cache
GPU Max GPU Count: Up to 2 single-width GPU(s)
Supported GPU: NVIDIA PCIe: T1000, L4, A2
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory Slot Count: 16 DIMM slots/8 Channels
Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM
Drive Bays Configuration Default: Total 10 bay(s)
10 front hot-swap 2.5" PCIe 5.0 NVMe*/SAS*/SATA drive bay(s)
(*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for
details)
M.2: 2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)
Expansion Slots Default
2 PCIe 5.0 x16 FHHL slot(s)
2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
On-Board Devices SATA: SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe: NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
Chipset: Intel® C741
Network Connectivity: Via AIOM
IPMI: Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB: 2 USB 3.2 Gen1 Type-A port(s) (rear)
2 USB 2.0 Type-A port(s) (front)
Video: 1 VGA port(s)
Serial: 1 COM port(s) (Rear)
TPM: 1 TPM header
System Cooling Fans: 6 middle cooling PWM 40x40x56mm Fan(s)
Power Supply 2x 800W/860W Redundant (1 + 1) Titanium Level power supplies
System BIOS BIOS Type: AMI 32MB SPI Flash EEPROM
Management CPU: Monitors for CPU Cores, Chipset Voltages, Memory
8 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment
Thermal Control for fan connector
PC Health Monitoring FAN: Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Voltage:
System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU
thermal trip support
Dimensions and Weight Weight: Gross Weight: 40 lbs (18.1 kg)
Net Weight: 25 lbs (11.3 kg)
Available Color: Black front & silver body
Operating Environment Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)
Motherboard X13SEDW-F
Chassis CSE-LB16TS-R0AWNP3
.
Provedení serveru
Rack
HDD Kapacita (GB)
960

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BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR

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Naposledy navštívené
ABCOM Košice s.r.o.
Gudernova 3
04011 Košice
Slovenská Republika
IČO: 46112961
IČ DPH (DIČ): SK2023229560
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